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Knauf Thermal Laminate
Expanded polystyrene bonded to 9.5mm Wallboard.
(Available in vapour check grade). Has a Thermal Conductivity figure for wallboard of k=0.16W and for Expanded Polystyrene of 0.038W/mK. Thermal Resistance.  22mm - 0.39m2K/W  30mm - 0.60m2K/W  40mm - 0.86m2K/W

All thickness in 1200x2400mm boards



Knauf Thermal Laminate Plus
CFC free extruded polystyrene bonded to 9.5mm Knauf Wallboard.
Low thermal conductivity means that thinner laminates can be used compared with expanded polystyrene laminates. Has a Thermal Conductivity figure for wallboard of k=0.16W and for Expanded Polystyrene of 0.030W/mK. Thermal Resistance.  27mm - 0.71m2K/W  35mm - 1.060m2K/W  40mm - 1.19m2K/W  
45mm - 1.37m2K/W  55mm - 1.75m2K/W

All thickness in 1200x2400mm boards

Insulation